Compact coating system MIA200 for evaporation- and sputter processes

In the basic version, the MIA®200 has a HiCube80 turbopump in combination with a diaphragm backing pump from Pfeiffer Vacuum, with the turbopump flanged directly to the chamber base. A Pirani gauge with display instrument, also mounted on the chamber floor, is used for pressure measurement. In this version, there are 3 DN200ISO blind flanges on the chamber. Chamber size and geometry, type and size of the pumping station as well as the type of vacuum measurement can be adapted to the customer's requirements within wide limits.

This makes the MIA®200 suitable as a versatile test stand and as a compact and modular coating system which, thanks to the standard components used, can be easily adapted and modified by the user if required.

MIA^®200 as test base for a Stirling cooler K535

MIA®200 with installed RGA as a test rig for a MicroStar® water vapor trap

In modern thin film technology, magnetron sputtering has become a versatile and important coating process. In its different variants, it enables the coating of surfaces with virtually all chemical elements and compounds.

For an uncomplicated and inexpensive entry into sputtering technology, we offer the compact tabletop sputtering system MIA®200pvd. In its basic version, this system has a 2''/50 mm DC magnetron cathode that sputters at an angle onto the rotating substrate. This achieves excellent layer thickness uniformity over a substrate diameter of >50 mm. The final pressure achievable with the turbo pump is in the lower 10-6 mbar range.

The 2'' magnetron cathode can also be installed in a parallel arrangement.  
As an option, the chamber can be equipped with 2 cathodes which can be operated alternatively or simultaneously. As a further option, a 500 W RF supply with auto-matching is also available. As with the MIA®200 basic, the chamber size and geometry, type and size of the pumping station, and the type of vacuum measurement can also be adapted to the customer's requirements within wide limits for the MIA®200pvd.

In addition to sputtering (elemental or reactive), the system can also be configured for other processes, such as thermal evaporation, PE-CVD or RIE.